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Overview[edit]

Electrochemical reactions that occur at the surface of an electrode can usually be broken into two steps: reactant species are transported from the bulk of the electrolyte solution to the electrode surface through mass transfer, and the species are subsequently reduced or oxidized at the electrode surface through electron transfer.

For modern semiconductor and printed circuit board applications, acid copper baths use additives that facilitate plating in high-aspect-ratio through holes. Such additives typically fall into one of three categories:

Suppressors (also known as carriers)
Accelerators (also known as brighteners)
Levelers